Job Description:
- This job will evaluate, characterize, and design high-speed (> 10GHz) packaging and PCB signal routing for our next-generation SoCs.  Job requirements include: characterizing loss, crosstalk, insertion loss, impedance matching, and other attributes at multi-GHz frequencies.  Simulations, test characterization, and chip-in-package design encompass chip-to-package, package-to-PCB, PCB-to-module, and across electrical/optical cables. Other related tasks include power-supply routing and bypassing, equalization and ISI mitigation, jitter and noise minimization.
 
Qualifications:
- Master's degree with minimum 2 years’ experience as signal integrity, high-frequency modeling engineer.
- High-Speed (> 10GHz) Package design, including RDL break-out routing, flip-chip, RDL, thermal heat dissipation analysis, bond-wire and BGA high-frequency simulation and optimization.
- Experience and understanding of impedance matching, crosstalk, equalization, noise processes, phase noise, and 10+ GHz performance.
- High-speed EM simulations, such as HFSS, ADS, and other related 2.5D/3D field solvers.
- Desired: previous experience with basic IC design, PCB prototyping, IC testing.
- Desired: High-level system programming, such as C/C++, python/Perl, LabView, Matlab.
- Desired: Lab experience using oscilloscopes, signal/pattern generators, BERT, spectrum analyzer, AWG, BERT, TDR/TDT.
- Preferred: Experience with high-speed optical testing, including BERT, eye mask, PAM4, jitter, optical coupling, impedance matching, etc.
 
jobs@photonic-tech.com