Responsibilities:

• Responsible for wafer to wafer bond process development supporting new MEMS processes and customers using industry standard tools.  
• Primary focus will be on AlGe eutectic bonding.  Familiarity with fusion bonding is a plus.
• Deep knowledge of both equipment and process is required.  
• The bonding process engineer is expected to know the equipment functions, recipes development/setup and operations in detail, and provide guidance to the equipment engineering team.  Examples are pressure and temperature uniformity monitoring and improvement, bond and heater chuck flatness control and monitoring, and factors influencing bond alignment.

• PHD / Masters in Applied Physics, Chemistry, Material Science, or Engineering.
• 3 years of experience with eutectic bonding using industry standard bond equipment such as EVG.
• 5 years’ experience with design of experiment techniques (DOE), Statistical Process Control (SPC), and failure analysis (FA).
• Good communication skills and a team player attitude are essential to foster interaction with Process Integration, Manufacturing, Production teams and Vendor/Suppliers.  The ability to communicate easily and clearly in English is required.
• Good working knowledge of statistics and practical experience using DOE and SPC with JMP is expected.
• Ability to multi-task is essential as several processes need to be developed in parallel.