1、Responsible for the process development of 8 or 12 inches wafer of wafer bonding process;
2、Responsible for prepare related documents used on wafer bonding equipment process buyoff and material evaluation;
3、Responsible for wafer bond process related technology transfer work, and solve problems in technology transfer wafer bond, confirmation, ensure product yield and cycle time reach the established target;
4、Responsible for make wafer bond and assistant process work instruction;
5、Responsible for optimizing and maintenance wafer bond and assistant process stabilization; 
6、Responsible for wafer bonder and assistant equipment parameter monitor, and create preventive flow about out of spec limit issue;
7、Responsible for evaluation 2nd resource，include: material、tools、Jig、 etc.; 
8、Organizing meetings and making decisions on abnormal status;
9、Make of NG and low yield products related disposal mothed and documents;
10、Responsible for training of new process engineers.
1.  負責8寸、12寸晶圓級臨時鍵合和永久鍵合工藝的開發(fā)；
2.  負責晶圓級鍵合、拆鍵合設備、材料的評估；
3.  負責優(yōu)化鍵合及后段相關工藝流程，并制定相關作業(yè)指導書；
4.  負責晶圓級臨時鍵合、拆鍵合、永久鍵合工藝的量產化及工藝的維護和優(yōu)化；
5.  負責晶圓鍵合及后段相關工藝技術轉移，解決鍵合及后段相關工藝轉移過程中出現的問題，使產品良率和cycle time達到既定目標；
6.  負責鍵合及后段相關工藝測試參數，對超出spec的產品做異常處理及預防；
7.  負責鍵合及后段相關工藝新耗材及2nd source耗材評估；
8.  決策受鍵合及后段相關工藝影響的產品能否release；
9.  制定鍵合及后段相關工藝不合格產品報廢；
10. 負責訓練新進工程師。

任職要求：
1、More than 8 year’s experiences of process engineer in 8'or 12'FAB;
2、Experience in process supporting to wafer bonder EVG or SUSS, and have high-level off-site process training;
3、Knowledge of SPC\DOE\FMEA \Control plan\8D and so on;
4、Outstanding English listening and speaking skills;
5、Skilled use of MS、 analysis software;
6、Have a sense of innovation and team work.
1、五年以上8寸或12寸半導體FAB工藝工程師工作經驗；
2、有晶圓鍵合EVG或SUSS設備使用經驗，并接受過高等級場外培訓；
3、有SPC\DOE\FMEA\8D等知識；
4、具有探索創(chuàng)新意識，工作積極主動；
5、能熟練應用Word、Excel、PPT等辦公軟件；
6、英文能力突出；
7、工作認真細致，有創(chuàng)新意識，有團隊精神。