The Failure Analysis Engineer determines the root cause of IC failure by using analog semiconductor IC related knowledge and technology and combining with professional FA techniques. Once the failure root cause has been identified, the Failure Analysis Engineer works with the related R&D team to solve the issue to improve IC quality and mass production smoothly.
FA運用專業(yè)的失效分析技術(shù)和半導體相關(guān)的知識會診芯片研發(fā)和制程中的IC失效根源，一旦確定失效原因，與其他研發(fā)團隊共同合作解決芯片Bug，提升芯片品質(zhì)和確保量產(chǎn)。
Responsibilities崗位職責:  
·           Support R&D (New Design/Process/Package development) 支持研發(fā)（新產(chǎn)品設(shè)計/流程/封裝工藝提升）
·           Support Internal Products yield enhancement 支持內(nèi)部產(chǎn)品良率改進
·           Customer’s failure analysis 客戶產(chǎn)品失效分析
Requirements崗位要求:
·           Master degree or equivalent (Semiconductor and micro-electronics Tech) 碩士及同等學歷（半導體及微電子技術(shù)專業(yè)）
·           Good knowledge of analog circuit, device, semiconductor IC manufacture process, etc.良好的模擬電路，器件，模擬集成電路制造流程等知識
·           Strong in analytical and communication (both verbal and written English) skills分析能力及溝通能力強（英語口語及書面表達良好）
·           Self-motivated, responsibility, goal-oriented and able to work in a team environment自我激勵，有責任感，目標導向，并且注重團隊合作